PLANER THICKNESSER DUAL 51

PLANER THICKNESSER DUAL 51 FORMAT-4

ADVANTAGES

• The thicknesser planer DUAL 51 FORMAT-4 allows an easy, synchronised opening of the solid planing table
• Minimum space requirement due to the optimised planing fence
• Intuitive, synchronised opening of the dual planing table 
• 'Power-drive' package for electrical control: electrical thicknesser table height control
• Easy to read depth of scale, optimally integrated into the machine chassis
• OPTIONAL: Innovative Silent-POWER spiral cutterblock halves noise emissions
• Highest operational safety, simplest operation: The new Format-4 planer guard

STANDARD EQUIPMENT

Electrical setup

• 3x 400 V motor voltage
• 50 Hz    
• 5.5 HP (4.0 kW)*
• Star-delta start

Cutterblock      

• Surface planing width in mm 510
• Total planer table length in mm 2250
• Infeed planer table length in mm 1100
• Maximum depth of cut in mm 8
• Professional planer fence, 1300 x 170 mm        
• Planer guard EURO “Standard”
• 4-knife FORMAT-4-system cutterblock              
• Number of knives - Silent-POWER spiral cutterblock: 77 (Sensationally quiet, noise emissions halved; Blade life up to 20 times longer; Four highly precise cutting edges on each knife; Optimised chip extraction and reduced chip volume; Tear free planing results; Reduced power consumption when compared to similar systems) (OPTIONAL)

Thicknesser

• Thicknessing planing width in mm 504mm
• Thicknessing height min.–max. 3-254 mm
• Maximum depth of cut in mm 8
• Electrical thicknesser table height control
• “Power-Drive”: electrical thicknesser table height control
• OPTIONAL “Digi-Drive”: position control for thicknesser table height, pre-programmable with pre-setting of dimensions
• Variable speed drive 4–16 m/min

General

• Weight kg (with standard configuration) 900

OPTIONAL

• Power feed mount
• Coupling system for table extension for surface planer tables 510 mm
• Workpiece roller on the infeed side
• Table extension with workpiece roller for the thicknesser 510 x 570 mm, only possible at a maximum chip removal of 5 mm (when surface planing)